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The layer stack-up defines the electrical and mechanical architecture of your PCB. It determines impedance, crosstalk, EMI performance, and board warpage — before a single component is placed. A well-planned stack-up makes challenging designs straigh
All PCB materials UL-recognized, RoHS-compliant (EU 2015/863), REACH-compliant. Material declarations and certificates with every order.
Panasonic MEGTRON6 R-5775 is a high-speed, low-loss multilayer laminate designed for next-generation RF and high-frequency digital applications. With a dielectric constant (Dk) of approximately 3.5 and a dissipation factor (Df) of 0.004 at 1 GHz, R-5
High-speed, high-layer-count PCB assembly for AI accelerators, edge inference devices, and embedded AI systems — with 100G+ signal integrity verified using low-loss materials.